BGA machine
Overview:
The laser BGA rework system is applied with the laser heating method; its principle is that the laser acts on the surface of the chip after being expanded, reflected and focused, and the surface heat is diffused to the inside through heat conduction; the laser pulse width, energy, peak power and repetition frequency are precisely controlled by digitization to
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Features:
Open dark infrared heating, no nozzles required, low costs of use.
The non-contact infrared sensor monitors the BGA temperature real-timely, and the desoldering is under control.
Intelligent and highly automated, computer controlled.
Easy to learn; successful soldering only takes 10 minutes of operation.
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Model EA-A20 General Power 6600 W (Max) Power Supply 220V AC 50HZ Hot Air Heating Temperature 400°C(Max) Bottom Preheating Temperature 400°C(Max) Power Of Top Heater(Hot Air) 1200W Power Of Bottom Heater(Infrared Preheating) 1600 W Hot Air
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