Overview:

The laser BGA rework system is applied with the laser heating method; its principle is that the laser acts on the surface of the chip after being expanded, reflected and focused, and the surface heat is diffused to the inside through heat conduction; the laser pulse width, energy, peak power and repetition frequency are precisely controlled by digitization to melt the solder ball and solder joint after reaching the melting point, and to weld the processed workpieces by laser. It is applicable to the surface mounting and rework of components of dense assembly products, etc. 

Features: 

Fine welding, bright and beautiful solder joints.
High welding speed, small thermal deformation, only heating the surface of the reworked component, small impact on the periphery, preferred choice for the dense welding.
Uniform temperature and precise control of the reflow curve.
No nozzles required to be replaced, heating graphs programmable.
21.5-inch touch screen, heating graphics drawn by the high-precision touch pen.

Specifications:

Power Supply	220V  AC  50 Hz
Total Power	3500 W (Max)
Laser Type	Optical laser
Laser Power	80W
Spot Size	Φ1 - 3 mm
Heating Programmable Range	60 mm * 60 mm
Heating Scan Speed	100 - 7000 mm/s
Bottom Preheating Area	300 mm * 300 mm
Bottom Preheating Power	3200 W
Max. PCB Size	320 mm * 350 mm
Preheating Temperature Range Of PCB	Room temperature - 200℃
Aligning Accuracy	± 0.02 mm
Weight	About 300 kg
Overall Dimensions (L* W *H)	1280 * 1020 * 1700 mm