Features:
IR Infrared Reflow Soldering System
The infrared temperature sensor directly detects the surface temperature of the BGA to achieve true closed-loop control, ensuring an accurate temperature process window and uniform heat distribution.
PL Precise Alignment System
The high-definition optical chromatic aberration prism alignment system is used to align the solder ball and pad by overlapping; scientific and precise, simple control, and easy to mount and release.
RPC Reflow Soldering Camera
The melting process of the BGA solder ball can be observed from multiple angles from the lateral bearing, providing critical assistance in capturing accurate and reliable process curves.
BGASOFT Control Software
PC is connected to record, control, and analyze the entire process flow, and generate a temperature curve to meet the process requirements of the modern electronics industry.
CONTROL BOX Operation Keyboard
Multi-functional operation keyboard makes continuous rework more efficient and simple.
Applicable to: laptop motherboard, mobile phone motherboard, PAD, IPC mainboard, etc.
Specifications:
IR Infrared Reflow Soldering System
PL Precise Mounting and Placement System
RPC Reflow Soldering Monitoring Camera
IR Infrared Reflow Soldering System
The infrared temperature sensor directly detects the surface temperature of the BGA to achieve true closed-loop control, ensuring an accurate temperature process window and uniform heat distribution.
PL Precise Alignment System
The high-definition optical chromatic aberration prism alignment system is used to align the solder ball and pad by overlapping; scientific and precise, simple control, and easy to mount and release.
RPC Reflow Soldering Camera
The melting process of the BGA solder ball can be observed from multiple angles from the lateral bearing, providing critical assistance in capturing accurate and reliable process curves.
BGASOFT Control Software
PC is connected to record, control, and analyze the entire process flow, and generate a temperature curve to meet the process requirements of the modern electronics industry.
CONTROL BOX Operation Keyboard
Multi-functional operation keyboard makes continuous rework more efficient and simple.
Applicable to: laptop motherboard, mobile phone motherboard, PAD, IPC mainboard, etc.
Specifications:
IR Infrared Reflow Soldering System
| Total Power | 2800 W (Max) |
| Power Supply | 220V AC 50 Hz |
| Bottom Preheating Power | 400 W * 4= 1600 W (dark infrared emitter) |
| 500 W * 4 = 2000 W (high-resolution infrared heating tube optional) | |
| Top Preheating Power | 120W * 4 = 720 W (infrared heating tube, wavelength: about 2-8 μm) |
| Top Heater Size Range | 20 – 60 mm (X, Y directions adjustable) |
| Bottom Radiation Preheater Size | 290 * 290 mm |
| Max. Circuit Board Size | 390 * 420 mm |
| Communication | USB (can be connected with PC) |
| Temperature Measuring Sensor | Non-contact infrared |
| Weight | About 80 kg |
| Overall Dimensions | 850 * 720 * 730 mm |
PL Precise Mounting and Placement System
| Camera | 36 * 12 times amplification; 24 V / 300 mA; horizontal definition 500 lines; PAL format |
| Prism Size | 50 mm * 50 mm |
| Reworked BGA Size | 2 x 2 mm – 60 x 60 mm |
| Camera Output Signal | Video signal |
RPC Reflow Soldering Monitoring Camera
| Camera | 36*12 times amplification |
| Horizontal definition 500 lines; PAL format | |
| LED auxiliary lighting | |
| Control Box | Multi-functional operation keyboard |
| Acquisition Card | Four-channel analog video input |
| Video Soft | Professional video acquisition software |
Inquiry - QUICK EA-H00
