High automation, one-touch for rework, soldering, pick-up and placement of chip, easy operation.
Large power brushless DC fan, closed loop sensor, microcomputer zero trigger control, large volume air with constant temperature. No need of external air source, flexible application.
Seven-phase temperature zone, can be used for light-reflecting BGA, multi-layer BGA and metallic shielding case, POP.
Integrated design, the heating and alignment systems integrate well.
Dichromatic optical prism alignment, joystick control.
Transverse flow fan, air speed controllable, cool down bottom heating area and PCB as per process requirement.
QUICKSOFT interface, operation access and profile analysis functions available, can analyze preheating speed, peak temperature, temperature holding time and cooling rate effectively.
Various nozzles, easy replacement.
Applications: PC, Server Motherboard, IPC, Terminal and large PCB rework BGA or CONNECT.
Model | EA-A10 |
General Power | 4200 W (Max) |
Power Supply | 220V AC 50HZ |
Hot Air Heating Temperature | 400°C(Max) |
Bottom Preheating Temperature | 400°C(Max) |
Power Of Top Heater(Hot Air) | 1200W |
Power Of Bottom Heater(Infrared Preheating) | 1600 W |
Hot Air Flow | 60 L/S |
Bottom Radiation Preheating Size | 400 mm * 400 mm |
Max. Circuit Board Size | 420 mm * 450 mm |
Chip Size Range | 2*2 mm – 60* 60 mm |
Placement Accuracy | ± 0.02 mm |
Placement Force | 1.5 N / zero pressure mounting (two modes) |
Adjustable Air Speed Of Side Cooling Fan | ≤35m3/min |
Camera | 36*12 times magnifying |
Horizontal resolution 500 lines | |
PAL (phase alternation line) format | |
LED Lighting | White light source (luminance adjustable) |
External K-Type Sensor | 5 channels |
Communication | USB |
Overall Dimensions (L*W*H) | 810 * 675 * 836 mm |
Inquiry - QUICK EA-A10