Features:
Based on the principle of dark infrared heating, the equipment has closed-loop temperature control, precise and stable temperature and small fluctuation. With dark infrared ceramic plate heating at the bottom and high-infrared heating tube at the top, it has an extremely long service life. It minimizes the lateral temperature difference of B G A to prevent cold soldering or overheating damage of BGA.
Designed with an observation window, allowing real-time observation for the melting of the BGA chip solder ball, and the BGA in different specifications soldered simultaneously.
When the cabinet is opened after the process ends, the cooling fan works automatically; when the cabinet is closed, the cooling fan also stops working.
The panel is equipped with an external K-type sensor to monitor the actual temperature of BGA.
A sound and light alarm is provided when the heating cabinet is opened during soldering.


Specifications:
Power Supply: 220 V AC 50 Hz
Top Hot Air Heating Power: 500 W
Bottom Preheating Power: 400 W
Temperature Range: 50 ℃ - 300 ℃
Heating Zone Size: 130 * 130 mm
Weight: About 9 kg
Overall Dimensions: 355 * 225 * 180 mm