- Non-contact micro air soldering system for soldering tiny solder joints.
- Stable hot air flow and good soldering quality.
- No solder residues generated, no consumables produced, and saving costs.
- With the specially designed heating element, it has a wide temperature range, no oxidation and long service life.
- It is especially suitable for the rear heating of the solder paste process.
- Stroke Parameter: Reference carrying platform
- Flow: 0-4 L/min
- Temperature Range: 50-550℃ (Max, working mode selection)
- Heating Controller Power: 300 W