Desktop Reflow Oven
QUICK EA-FH1015
Features:
- A 10-section temperature zone designed to control the temperature and time of any zone and customize the reflow process.
- Optional reflow soldering process camera, multi-angle observation of solder paste reflow interval changes.
- It heats using internal circulation hot air to completely simulate the reflow heating process.
- Nitrogen can be inputted for protecting the heating to ensure high quality soldering.
- Built-in automatic cooling design, the cooling rate controllable.
Specifications:
- Power Supply: 220 V AC 50 Hz
- Peak Power: 3300 W
- Air / Nitrogen Inlet Pressure: ≤ 0.5 MPA
- Max. Flow Of Reflow Fan: 1.6 – 1.8 m^3/min/220V
- Max. Cooling/ Heating Rate: ≤ 3 ℃/S
- Max. PCB Size: 150 mm * 200 mm
- Weight: About 60 kg
- Overall Dimensions (L*W*H): 800 * 650 *650 mm
