Desktop Reflow Oven

QUICK EA-FH1015

QUICK EA-FH1015

    Features:
  • A 10-section temperature zone designed to control the temperature and time of any zone and customize the reflow process.
  • Optional reflow soldering process camera, multi-angle observation of solder paste reflow interval changes.
  • It heats using internal circulation hot air to completely simulate the reflow heating process.
  • Nitrogen can be inputted for protecting the heating to ensure high quality soldering.
  • Built-in automatic cooling design, the cooling rate controllable.
    Specifications:
  • Power Supply: 220 V AC 50 Hz
  • Peak Power: 3300 W
  • Air / Nitrogen Inlet Pressure: ≤ 0.5 MPA
  • Max. Flow Of Reflow Fan: 1.6 – 1.8 m^3/min/220V
  • Max. Cooling/ Heating Rate: ≤ 3 ℃/S
  • Max. PCB Size: 150 mm * 200 mm
  • Weight: About 60 kg
  • Overall Dimensions (L*W*H): 800 * 650 *650 mm