QUICK 3000
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Features:
- Based on the principle of dark infrared heating, the equipment has closed-loop temperature control, precise and stable temperature and small fluctuation. With dark infrared ceramic plate heating at the bottom and high-infrared heating tube at the top, it has an extremely long service life. It minimizes the lateral temperature difference of B G A to prevent cold soldering or overheating damage of BGA.
- Designed with an observation window, allowing real-time observation for the melting of the BGA chip solder ball, and the BGA in different specifications soldered simultaneously.
- When the cabinet is opened after the process ends, the cooling fan works automatically; when the cabinet is closed, the cooling fan also stops working.
- The panel is equipped with an external K-type sensor to monitor the actual temperature of BGA.
- A sound and light alarm is provided when the heating cabinet is opened during soldering.
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Specifications:
- Power Supply: 220 V AC 50 Hz
- Top Hot Air Heating Power: 500 W
- Bottom Preheating Power: 400 W
- Temperature Range: 50 ℃ - 300 ℃
- Heating Zone Size: 130 * 130 mm
- Weight: About 9 kg
- Overall Dimensions: 355 * 225 * 180 mm