BGA Reballing Reflow Machine

QUICK 3000

QUICK 3000

    Features:
  • Based on the principle of dark infrared heating, the equipment has closed-loop temperature control, precise and stable temperature and small fluctuation. With dark infrared ceramic plate heating at the bottom and high-infrared heating tube at the top, it has an extremely long service life. It minimizes the lateral temperature difference of B G A to prevent cold soldering or overheating damage of BGA.
  • Designed with an observation window, allowing real-time observation for the melting of the BGA chip solder ball, and the BGA in different specifications soldered simultaneously.
  • When the cabinet is opened after the process ends, the cooling fan works automatically; when the cabinet is closed, the cooling fan also stops working.
  • The panel is equipped with an external K-type sensor to monitor the actual temperature of BGA.
  • A sound and light alarm is provided when the heating cabinet is opened during soldering.
    Specifications:
  • Power Supply: 220 V AC 50 Hz
  • Top Hot Air Heating Power: 500 W
  • Bottom Preheating Power: 400 W
  • Temperature Range: 50 ℃ - 300 ℃
  • Heating Zone Size: 130 * 130 mm
  • Weight: About 9 kg
  • Overall Dimensions: 355 * 225 * 180 mm